An overview of microsystems technology is presented along with a discussion of the recent trends and challenges associated with its development. A typical bottom-up design methodo...
Michael S. McCorquodale, Fadi H. Gebara, Keith L. ...
This paper presents an electrical and thermal performance analysis of System-in-a-Package (SiP) memory/logic implementation platform based on ChipLaminate-Chip (CLC) technology. I...
Michael X. Wang, Katsuharu Suzuki, Wayne Wei-Ming ...
Third-party transfer is a data transfer mechanism where the party initiating the transfer is neither the source nor the sink for the data. In this paper, we present a scheme for s...
Abstract. At present, network users have to manage one set of authentication credentials (usually a username/password pair) for every service with which they are registered. Single...
Abstract. A coinduction-based technique to generate an optimal monitor from a Linear Temporal Logic (LTL) formula is presented in this paper. Such a monitor receives a sequence of ...