Energy expenses are becoming an increasingly important fraction of data center operating costs. At the same time, the energy expense per unit of computation can vary significantl...
Asfandyar Qureshi, Rick Weber, Hari Balakrishnan, ...
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
In this paper, a comprehensive and fast method is presented for the timing analysis of process variations on single-walled carbon nanotube (SWCNT) bundles. Unlike previous works t...
Double patterning lithography seems to be a prominent choice for 32nm and 22nm technologies. Double patterning lithography techniques require additional masks for a single interco...
Kwangok Jeong, Andrew B. Kahng, Rasit Onur Topalog...
WIMAX (Worldwide Interoperability for Microwave Access) is a promising new networking technology that potentially offers high speed and wide area wireless access services that com...