3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
An important part of our information-gathering behavior has always been to find out what other people think. With the growing availability and popularity of opinion-rich resource...
Power management has become increasingly necessary in large-scale datacenters to address costs and limitations in cooling or power delivery. This paper explores how to integrate p...
Abstract— In this paper, we present a novel and comprehensive resource management solution for the autonomous hot-spot convergence system (AHSCS) that uses sensor web. This solut...
Recently, Continua Health Alliance has brought together a powerhouse team, including Cisco, IBM, Motorola and others, for personal telehealth products and services. This team will...
Celina Gibbs, Daniel Lohmann, Chunjian Robin Liu, ...