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MICRO
2006
IEEE
144views Hardware» more  MICRO 2006»
16 years 12 days ago
Die Stacking (3D) Microarchitecture
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
Bryan Black, Murali Annavaram, Ned Brekelbaum, Joh...
FTIR
2007
119views more  FTIR 2007»
15 years 6 months ago
Opinion Mining and Sentiment Analysis
An important part of our information-gathering behavior has always been to find out what other people think. With the growing availability and popularity of opinion-rich resource...
Bo Pang, Lillian Lee
SOSP
2007
ACM
16 years 3 months ago
VirtualPower: coordinated power management in virtualized enterprise systems
Power management has become increasingly necessary in large-scale datacenters to address costs and limitations in cooling or power delivery. This paper explores how to integrate p...
Ripal Nathuji, Karsten Schwan
IPPS
2002
IEEE
15 years 11 months ago
FARM: A Feedback-Based Adaptive Resource Management for Autonomous Hot-Spot Convergence System
Abstract— In this paper, we present a novel and comprehensive resource management solution for the autonomous hot-spot convergence system (AHSCS) that uses sensor web. This solut...
S. Swaminathan, G. Manimaran
HICSS
2007
IEEE
141views Biometrics» more  HICSS 2007»
16 years 22 days ago
Modular Integration Through Aspects: Making Cents of Legacy Systems
Recently, Continua Health Alliance has brought together a powerhouse team, including Cisco, IBM, Motorola and others, for personal telehealth products and services. This team will...
Celina Gibbs, Daniel Lohmann, Chunjian Robin Liu, ...