8413 search results - page 1202 / 1683 » Ordering Problem Subgoals |
163
click to vote
ICCD
2008
IEEE
16 years 4 months ago
2008
IEEE
— Increasing sizes of benchmarks make detailed simulation an extremely time consuming process. Statistical techniques such as the SimPoint methodology have been proposed in order...
196
click to vote
ICCD
2007
IEEE
16 years 4 months ago
2007
IEEE
Microarchitectural simulation is orders of magnitude slower than native execution. As more elements are accurately modeled, problems associated with slow simulation are further ex...
182
click to vote
ICCAD
2008
IEEE
16 years 3 months ago
2008
IEEE
— With process variation becoming a growing concern in deep submicron technologies, the ability to efficiently obtain an accurate estimate of failure probability of SRAM compone...
181
click to vote
ICCAD
2007
IEEE
16 years 3 months ago
2007
IEEE
While circuit density and power efficiency increase with each major advance in IC technology, reliability with respect to soft errors tends to decrease. Current solutions to this...
167
click to vote
ICCAD
2005
IEEE
16 years 3 months ago
2005
IEEE
— The flip-chip package gives the highest chip density of any packaging method to support the pad-limited Application-Specific Integrated Circuit (ASIC) designs. In this paper,...