Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
Yongxiang Liu, Yuchun Ma, Eren Kursun, Glenn Reinm...
—This paper introduces the microarchitecture and logical implementation of SMT (Simultaneous Multithreading) improvement of Godson-2 processor which is a 64-bit, four-issue, out-...
Dynamic address compression schemes that exploit address locality can help reduce both address bus energy and cost simultaneously with only a small performance penalty. In this wo...
Jiangjiang Liu, Krishnan Sundaresan, Nihar R. Maha...
We present a simulation-based semi-formal verification method for sequential circuits described at the registertransfer level. The method consists of an iterative loop where cove...
Serdar Tasiran, Farzan Fallah, David G. Chinnery, ...
Several technologies with sub-lithographic features are targeting the fabrication of crossbar memories in which the nanowire decoder is playing a major role. In this paper, we sug...
M. Haykel Ben Jamaa, Kirsten E. Moselund, David At...