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ISCAS
2006
IEEE
112views Hardware» more  ISCAS 2006»
16 years 3 days ago
Fine-grain thermal profiling and sensor insertion for FPGAs
– Increasing logic densities and clock frequencies on FPGAs lead to rapid increase in power density, which translates to higher on-chip temperature. In this paper, we investigate...
Somsubhra Mondal, Rajarshi Mukherjee, Seda Ogrenci...
165
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INFOCOM
2005
IEEE
15 years 11 months ago
Exploiting heterogeneity in sensor networks
—The presence of heterogeneous nodes (i.e., nodes with an enhanced energy capacity or communication capability) in a sensor network is known to increase network reliability and l...
Mark D. Yarvis, Nandakishore Kushalnagar, Harkirat...
INFOVIS
2005
IEEE
15 years 11 months ago
Dynamic Visualization of Graphs with Extended Labels
The paper describes a novel technique to visualize graphs with extended node and link labels. The lengths of these labels range from a short phrase to a full sentence to an entire...
Pak Chung Wong, Patrick Mackey, Ken Perrine, James...
ISQED
2005
IEEE
98views Hardware» more  ISQED 2005»
15 years 11 months ago
Wire Planning with Bounded Over-the-Block Wires
Hierarchical approach greatly facilitates large-scale chip design by hiding distracting details in low-level objects. However, the lowlevel designs have to have a global view of h...
Hua Xiang, I-Min Liu, Martin D. F. Wong
ISPD
2005
ACM
140views Hardware» more  ISPD 2005»
15 years 11 months ago
Are floorplan representations important in digital design?
Research in floorplanning and block-packing has generated a variety of data structures to represent spatial configurations of circuit modules. Much of this work focuses on the g...
Hayward H. Chan, Saurabh N. Adya, Igor L. Markov