Different formal learning models address different aspects of learning. Below we compare learning via queries—interpreting learning as a one-shot process in which the learner i...
— The increasing viability of three dimensional (3D) silicon integration technology has opened new opportunities for chip architecture innovations. One direction is in the extens...
We propose to introduce redundant interconnects for manufacturing yield and reliability improvement. By introducing redundant interconnects, the potential for open faults is reduc...
This paper describes the design, implementation, and evaluation of a replication scheme to handle Byzantine faults in transaction processing database systems. The scheme compares ...
Ben Vandiver, Hari Balakrishnan, Barbara Liskov, S...
Diagnosing production run failures is a challenging yet important task. Most previous work focuses on offsite diagnosis, i.e. development site diagnosis with the programmers prese...
Joseph Tucek, Shan Lu, Chengdu Huang, Spiros Xanth...