—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...
There is an increasing need for automated support for humans monitoring the activity of distributed teams of cooperating agents, both human and machine. We characterize the domain...
Software bugs that occur in production are often difficult to reproduce in the lab due to subtle differences in the application environment and nondeterminism. To address this pr...
As transistor dimensions continue to scale deep into the nanometer regime, silicon reliability is becoming a chief concern. At the same time, transistor counts are scaling up, ena...
Andrew DeOrio, Konstantinos Aisopos, Valeria Berta...
In floating-point datapaths synthesized on FPGAs, the shifters that perform mantissa alignment and normalization consume a disproportionate number of LUTs. Shifters are implemente...
Yehdhih Ould Mohammed Moctar, Nithin George, Hadi ...