53302 search results - page 296 / 10661 » On the design of a |
173
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DAC
2011
ACM
14 years 6 months ago
2011
ACM
Micro-channel cooling shows great potential in removing high density heat in 3D circuits. The current micro-channel heat sink designs spread the entire surface to be cooled with m...
163
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ASPDAC
2007
ACM
15 years 10 months ago
2007
ACM
Abstract-- Multiprocessor designs have become popular in embedded domains for achieving the power and performance requirements. In this paper, we present principles and techniques ...
164
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DAC
2000
ACM
16 years 7 months ago
2000
ACM
eously demand shorter and less costly design cycles. Designing at higher levels of abstraction makes both objectives achievable, but enabling techniques like behavioral synthesis h...
184
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DAC
2001
ACM
16 years 7 months ago
2001
ACM
Milenko Drinic UCLA Computer Science Dep. 4732 Boelter Hall Los Angeles, CA 90095-1596 milenko@cs.ucla.edu Darko Kirovski Microsoft Research One Microsoft Way Redmond, WA 98052 da...
154
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DAC
2004
ACM
16 years 7 months ago
2004
ACM
As technology advances, the metal width is decreasing with the length increasing, making the resistance along the power line increase substantially. Together with the nonlinear sc...