Increasing power densities in Field Programmable Gate Arrays (FPGAs) have made them susceptible to thermal problems. The advent of platform FPGAs has further exacerbated the probl...
Priya Sundararajan, Aman Gayasen, Narayanan Vijayk...
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
In this paper we present a family of multi-objective hypergraph partitioning algorithms based on the multilevel paradigm, which are capable of producing solutions in which both th...
Energy consumption has become an important issue in high-end data centers, and disk arrays are one of the largest energy consumers within them. Although several attempts have been...
Qingbo Zhu, Zhifeng Chen, Lin Tan, Yuanyuan Zhou, ...
Online production groups have the potential to transform the way that knowledge is produced and disseminated. One of the most widely used forms of online production is the wiki, w...