10718 search results - page 750 / 2144 » On the Circuit Implementation Problem |
211
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JAIR
2010
15 years 6 months ago
2010
Model-based diagnostic reasoning often leads to a large number of diagnostic hypotheses. The set of diagnoses can be reduced by taking into account extra observations (passive mon...
226
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ICCAD
2009
IEEE
15 years 5 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
336
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ISCA
2011
IEEE
14 years 11 months ago
2011
IEEE
Emerging memory technologies such as STT-RAM, PCRAM, and resistive RAM are being explored as potential replacements to existing on-chip caches or main memories for future multi-co...
250
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ISPD
2012
ACM
14 years 3 months ago
2012
ACM
In this paper, we propose a new approach for gated bus synthesis [16] with minimum wire capacitance per transaction in three-dimensional (3D) ICs. The 3D IC technology connects di...
253
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VLSID
2009
IEEE
16 years 8 months ago
2009
IEEE
Many system-level design tasks (e.g. timing analysis, hardware/software partitioning and design space exploration) involve computational kernels that are intractable (usually NP-ha...