10718 search results - page 642 / 2144 » On the Circuit Implementation Problem |
183
click to vote
DAC
2007
ACM
16 years 8 months ago
2007
ACM
The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literatur...
206
click to vote
DAC
2002
ACM
16 years 8 months ago
2002
ACM
We have developed a generic integer linear programming(ILP)based engineering change(EC) methodology. The EC methodology has three components: enabling, fast, and preserving. Enabl...
198
click to vote
ICCAD
2005
IEEE
16 years 4 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
188
click to vote
COCO
2007
Springer
16 years 1 months ago
2007
Springer
We consider the k-layer pointer jumping problem in the one-way multi-party number-on-the-forehead communication model. Sufficiently strong lower bounds for the problem would have...
214
click to vote
VLSID
1998
IEEE
15 years 11 months ago
1998
IEEE
With several commercial tools becoming available, the high-level synthesis of applicationspeci c integrated circuits is nding wide spread acceptance in VLSI industry today. Existi...