10718 search results - page 604 / 2144 » On the Circuit Implementation Problem |
196
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VTS
2003
IEEE
16 years 15 days ago
2003
IEEE
—We present a dictionary-based test data compression approach for reducing test data volume and testing time in SOCs. The proposed method is based on the use of a small number of...
178
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ISPD
2003
ACM
16 years 15 days ago
2003
ACM
The thermal problem has been emerged as one of the key issues for next-generation IC design. In this paper, we propose a scheme to achieve better thermal distribution for partitio...
210
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SMA
2003
ACM
16 years 15 days ago
2003
ACM
In this paper a graph-based method is presented which not only characterizes topological classification of the tessellated surfaces but also simultaneously generates the substanti...
179
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DATE
2010
IEEE
16 years 10 days ago
2010
IEEE
—Temperature has a strong influence on integrated circuit (IC) performance, power consumption, and reliability. However, accurate thermal analysis can impose high computation co...
151
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DATE
2002
IEEE
16 years 6 days ago
2002
IEEE
The relative tolerances for interconnect and device parameter variations have not scaled with feature sizes which have brought about significant performance variability. As we sca...