10718 search results - page 537 / 2144 » On the Circuit Implementation Problem |
207
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ISPD
2010
ACM
16 years 2 months ago
2010
ACM
Double Patterning Lithography (DPL) is one of the few hopeful candidate solutions for the lithography for CMOS process beyond 45nm. DPL assigns the patterns less than a certain di...
201
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ISQED
2009
IEEE
16 years 1 months ago
2009
IEEE
The advance in semiconductor technologies presents the serious problem of parameter variations. They affect threshold voltage of transistors and thus circuit delay has variability...
165
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DATE
2009
IEEE
16 years 1 months ago
2009
IEEE
—Due to increasing complexity of design interactions between the chip, package and PCB, it is essential to consider them at the same time. Specifically the finger/pad locations...
173
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SLIP
2009
ACM
16 years 1 months ago
2009
ACM
As technology advances, 3D ICs are introduced for alleviating the interconnect problem coming with shrinking feature size and increasing integration density. In 3D ICs, one of the...
198
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DATE
2008
IEEE
16 years 1 months ago
2008
IEEE
—Increasing integrated circuit (IC) power densities and temperatures may hamper multiprocessor system-on-chip (MPSoC) use in hard real-time systems. This article formalizes the t...