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» On the Circuit Implementation Problem
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DAC
2006
ACM
16 years 28 days ago
Design in reliability for communication designs
Silicon design implementation has become increasingly complex with the deep submicron technologies such as 90nm and below. It is common to see multiple processor cores, several ty...
Uday Reddy Bandi, Murty Dasaka, Pavan K. Kumar
DAC
2006
ACM
16 years 28 days ago
A high density, carbon nanotube capacitor for decoupling applications
We present a novel application for carbon nanotube devices, implementing a high density 3-D capacitor, which can be useful for decoupling applications to reduce supply voltage var...
Mark M. Budnik, Arijit Raychowdhury, Aditya Bansal...
DAC
2006
ACM
16 years 28 days ago
Modeling and minimization of PMOS NBTI effect for robust nanometer design
Negative bias temperature instability (NBTI) has become the dominant reliability concern for nanoscale PMOS transistors. In this paper, a predictive model is developed for the deg...
Rakesh Vattikonda, Wenping Wang, Yu Cao
DATE
2005
IEEE
127views Hardware» more  DATE 2005»
16 years 17 days ago
A Novel Low-overhead Delay Testing Technique for Arbitrary Two-Pattern Test Application
— With increasing process fluctuations in nano-scale technology, testing for delay faults is becoming essential in manufacturing test to complement stuck-at-fault testing. Desig...
Swarup Bhunia, Hamid Mahmoodi-Meimand, Arijit Rayc...
GLVLSI
2005
IEEE
122views VLSI» more  GLVLSI 2005»
16 years 17 days ago
Thermal aware cell-based full-chip electromigration reliability analysis
A hierarchical scheme with cells and modules is crucial for managing design complexity during a large integrated circuit design. We present a methodology for thermal aware cell-ba...
Syed M. Alam, Donald E. Troxel, Carl V. Thompson