10718 search results - page 435 / 2144 » On the Circuit Implementation Problem |
167
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DAC
2007
ACM
16 years 8 months ago
2007
ACM
High efficiency low voltage DC-DC conversion is a key enabler to the design of power-efficient integrated circuits. Typically a star configuration of the DC-DC converters, where o...
189
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HPCA
2005
IEEE
16 years 7 months ago
2005
IEEE
If current technology scaling trends hold, leakage power dissipation will soon become the dominant source of power consumption in high performance processors. Caches, due to the f...
188
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ICCD
2004
IEEE
16 years 3 months ago
2004
IEEE
I/O placement has always been a concern in modern IC design. Due to flip-chip technology, I/O can be placed throughout the whole chip without long wires from the periphery of the...
154
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ICCAD
2004
IEEE
16 years 3 months ago
2004
IEEE
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...
170
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DATE
2007
IEEE
16 years 1 months ago
2007
IEEE
A high-level test synthesis (HLTS) method targeted for delay fault testability is presented. The proposed method, when combined with hierarchical test pattern generation for embed...