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» On the Circuit Implementation Problem
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GLVLSI
2006
IEEE
119views VLSI» more  GLVLSI 2006»
16 years 24 days ago
Thermal analysis of a 3D die-stacked high-performance microprocessor
3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
Kiran Puttaswamy, Gabriel H. Loh
CDES
2006
99views Hardware» more  CDES 2006»
15 years 8 months ago
Realization of Digital Fuzzy Operations Using Multi-Valued Fredkin Gates
Multi-valued Fredkin gates (MVFG) are reversible gates and they can be considered as modified version of the better known reversible gate the Fredkin gate. Reversible logic gates ...
Amin Ahsan Ali, Hafiz Md. Hasan Babu, Ahsan Raja C...
ICCAD
2008
IEEE
115views Hardware» more  ICCAD 2008»
16 years 3 months ago
Minimizing the energy cost of throughput in a linear pipeline by opportunistic time borrowing
- In this paper, we present a technique to optimize the energy-delay product of a synchronous linear pipeline circuit with dynamic error detection and correction capability running...
Mohammad Ghasemazar, Massoud Pedram
154
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ICCAD
2005
IEEE
107views Hardware» more  ICCAD 2005»
16 years 3 months ago
Projection-based performance modeling for inter/intra-die variations
Large-scale process fluctuations in nano-scale IC technologies suggest applying high-order (e.g., quadratic) response surface models to capture the circuit performance variations....
Xin Li, Jiayong Le, Lawrence T. Pileggi, Andrzej J...
ICCAD
2003
IEEE
113views Hardware» more  ICCAD 2003»
16 years 3 months ago
Retiming with Interconnect and Gate Delay
In this paper, we study the problem of retiming of sequential circuits with both interconnect and gate delay. Most retiming algorithms have assumed ideal conditions for the non-lo...
Chris C. N. Chu, Evangeline F. Y. Young, Dennis K....