Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
— Although the LUT (look-up table) size of FPGAs has been optimized for general applications, complicated designs may contain a large number of cascaded LUTs between flip-flops...
In this paper we present a family of multi-objective hypergraph partitioning algorithms based on the multilevel paradigm, which are capable of producing solutions in which both th...
In tree-based multicast systems, a relatively small number of interior nodes carry the load of forwarding multicast messages. This works well when the interior nodes are highlyava...
Miguel Castro, Peter Druschel, Anne-Marie Kermarre...
Energy consumption has become an important issue in high-end data centers, and disk arrays are one of the largest energy consumers within them. Although several attempts have been...
Qingbo Zhu, Zhifeng Chen, Lin Tan, Yuanyuan Zhou, ...