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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 3 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
ICCAD
2005
IEEE
127views Hardware» more  ICCAD 2005»
16 years 3 months ago
Flip-flop insertion with shifted-phase clocks for FPGA power reduction
— Although the LUT (look-up table) size of FPGAs has been optimized for general applications, complicated designs may contain a large number of cascaded LUTs between flip-flops...
Hyeonmin Lim, Kyungsoo Lee, Youngjin Cho, Naehyuck...
ICCAD
2003
IEEE
148views Hardware» more  ICCAD 2003»
16 years 3 months ago
Multi.Objective Hypergraph Partitioning Algorithms for Cut and Maximum Subdomain Degree Minimization
In this paper we present a family of multi-objective hypergraph partitioning algorithms based on the multilevel paradigm, which are capable of producing solutions in which both th...
Navaratnasothie Selvakkumaran, George Karypis
169
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SOSP
2003
ACM
16 years 3 months ago
SplitStream: high-bandwidth multicast in cooperative environments
In tree-based multicast systems, a relatively small number of interior nodes carry the load of forwarding multicast messages. This works well when the interior nodes are highlyava...
Miguel Castro, Peter Druschel, Anne-Marie Kermarre...
SOSP
2005
ACM
16 years 3 months ago
Hibernator: helping disk arrays sleep through the winter
Energy consumption has become an important issue in high-end data centers, and disk arrays are one of the largest energy consumers within them. Although several attempts have been...
Qingbo Zhu, Zhifeng Chen, Lin Tan, Yuanyuan Zhou, ...
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