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ICCAD
2006
IEEE
155views Hardware» more  ICCAD 2006»
16 years 3 months ago
Adaptive multi-domain thermal modeling and analysis for integrated circuit synthesis and design
Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
Yonghong Yang, Changyun Zhu, Zhenyu (Peter) Gu, Li...
164
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ISBI
2009
IEEE
16 years 1 months ago
Combining Mesh, Volume, and Streamline Representations for Polyp Detection in CT Colonography
CT colonography is a screening technique for adenomatous colorectal polyps, which are important precursors to colon cancer. Computer aided detection (CAD) systems are developed to...
Vincent Frans van Ravesteijn, Lingxiao Zhao, Charl...
CHI
2009
ACM
16 years 1 months ago
Understanding knowledge management practices for early design activity and its implications for reuse
Prior knowledge is a critical resource for design, especially when designers are striving to generate new ideas for complex problems. Systems that improve access to relevant prior...
Moushumi Sharmin, Brian P. Bailey, Cole Coats, Kev...
SC
2009
ACM
16 years 1 months ago
Future scaling of processor-memory interfaces
Continuous evolution in process technology brings energyefficiency and reliability challenges, which are harder for memory system designs since chip multiprocessors demand high ba...
Jung Ho Ahn, Norman P. Jouppi, Christos Kozyrakis,...
CLUSTER
2009
IEEE
16 years 1 months ago
Topics on measuring real power usage on high performance computing platforms
—Power has recently been recognized as one of the major obstacles in fielding a Peta-FLOPs class system. To reach Exa-FLOPs, the challenge will certainly be compounded. In this ...
James H. Laros, Kevin T. Pedretti, Suzanne M. Kell...
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