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» On Industrial Use of Requirements Engineering Techniques
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DATE
2006
IEEE
152views Hardware» more  DATE 2006»
16 years 14 days ago
Adaptive chip-package thermal analysis for synthesis and design
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
Yonghong Yang, Zhenyu (Peter) Gu, Changyun Zhu, Li...
SIGSOFT
2005
ACM
16 years 7 months ago
Strathcona example recommendation tool
Using the application programming interfaces (API) of large software systems requires developers to understand details about the interfaces that are often not explicitly defined. ...
Reid Holmes, Robert J. Walker, Gail C. Murphy
WCRE
2009
IEEE
16 years 1 months ago
Automatic Package Coupling and Cycle Minimization
Abstract—Object-oriented (OO) software is usually organized into subsystems using the concepts of package or module. Such modular structure helps applications to evolve when faci...
Hani Abdeen, Stéphane Ducasse, Houari A. Sa...
ICSE
2007
IEEE-ACM
16 years 6 months ago
Behaviour Model Synthesis from Properties and Scenarios
Synthesis of behaviour models from software development artifacts such as scenario-based descriptions or requirements specifications not only helps significantly reduce the effort...
Greg Brunet, Marsha Chechik, Sebastián Uchi...
AAAI
1998
15 years 7 months ago
Producing BT's Yellow Pages with Formation
This case study illustrates how the adoption of AI technology can bene t smaller companies as well as major corporations. Pindar Set is a small UK company which has originated the...
Gail Anderson, Andrew Casson-du Mont, Ann Macintos...