7195 search results - page 763 / 1439 » On Computing Power |
169
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VLSID
2007
IEEE
16 years 7 months ago
2007
IEEE
Interconnect is one of the major concerns in current and future microprocessor designs from both performance and power consumption perspective. The emergence of three-dimensional ...
194
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MOBISYS
2007
ACM
16 years 7 months ago
2007
ACM
The ease of deployment of battery-powered and mobile systems is pushing the network edge far from powered infrastructures. A primary challenge in building untethered systems is of...
198
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ISCA
2009
IEEE
16 years 2 months ago
2009
IEEE
Analysis of technology and application trends reveals a growing imbalance in the peak compute-to-memory-capacity ratio for future servers. At the same time, the fraction contribut...
212
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ASPDAC
2009
ACM
16 years 1 months ago
2009
ACM
Three-dimensional stacking of silicon layers is emerging as a promising solution to handle the design complexity and heterogeneity of Systems on Chips (SoCs). Networks on Chips (N...
236
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WCNC
2008
IEEE
16 years 1 months ago
2008
IEEE
—In this paper, a wireless cognitive radio sensor network is considered, where each sensor node is equipped with cognitive radio and the network is a multi-carrier system operati...