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142
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DSD
2009
IEEE
16 years 1 months ago
2009
IEEE
— 3D stacked architectures provide significant benefits in performance, footprint and yield. However, vertical stacking increases the thermal resistances, and exacerbates tempe...
206
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GLVLSI
2009
IEEE
16 years 1 months ago
2009
IEEE
In this paper, we propose novel architectural and design techniques for three-dimensional field-programmable gate arrays (3D FPGAs) with Through-Silicon Vias (TSVs). We develop a...
180
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ICC
2009
IEEE
16 years 1 months ago
2009
IEEE
— In this paper, we propose a game theoretical approach to tackle the problem of the distributed formation of the uplink tree structure among the relay stations (RSs) and their s...
186
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INFOCOM
2009
IEEE
16 years 1 months ago
2009
IEEE
— This work focuses on a class of distributed storage systems whose content may evolve over time. Each component or node of the storage system is mobile and the set of all nodes ...
192
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MICRO
2009
IEEE
16 years 1 months ago
2009
IEEE
Aggressive technology scaling to 45nm and below introduces serious reliability challenges to the design of microprocessors. Large SRAM structures used for caches are particularly ...