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» New efficient algorithms for computing effective capacitance
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SLIP
2009
ACM
16 years 1 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
APPT
2005
Springer
16 years 1 days ago
Principal Component Analysis for Distributed Data Sets with Updating
Identifying the patterns of large data sets is a key requirement in data mining. A powerful technique for this purpose is the principal component analysis (PCA). PCA-based clusteri...
Zheng-Jian Bai, Raymond H. Chan, Franklin T. Luk
HPDC
2010
IEEE
15 years 7 months ago
Resource provisioning with budget constraints for adaptive applications in cloud environments
The recent emergence of clouds is making the vision of utility computing realizable, i.e. computing resources and services can be delivered, utilized, and paid for as utilities su...
Qian Zhu, Gagan Agrawal
RECOMB
2003
Springer
16 years 6 months ago
Physical network models and multi-source data integration
We develop a new framework for inferring models of transcriptional regulation. The models in this approach, which we call physical models, are constructed on the basis of verifiab...
Chen-Hsiang Yeang, Tommi Jaakkola
DAC
2010
ACM
15 years 10 months ago
LUT-based FPGA technology mapping for reliability
As device size shrinks to the nanometer range, FPGAs are increasingly prone to manufacturing defects. We anticipate that the ability to tolerate multiple defects will be very impo...
Jason Cong, Kirill Minkovich