Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Identifying the patterns of large data sets is a key requirement in data mining. A powerful technique for this purpose is the principal component analysis (PCA). PCA-based clusteri...
The recent emergence of clouds is making the vision of utility computing realizable, i.e. computing resources and services can be delivered, utilized, and paid for as utilities su...
We develop a new framework for inferring models of transcriptional regulation. The models in this approach, which we call physical models, are constructed on the basis of verifiab...
As device size shrinks to the nanometer range, FPGAs are increasingly prone to manufacturing defects. We anticipate that the ability to tolerate multiple defects will be very impo...