5355 search results - page 147 / 1071 » Modules |
170
click to vote
IPPS
2000
IEEE
15 years 11 months ago
2000
IEEE
In this paper, we present a new packaging architecture for chip-level optical interconnections based on imaging fiber bundles. Imaging fiber bundles consist of densely packed arra...
143
click to vote
IPPS
2000
IEEE
15 years 11 months ago
2000
IEEE
This paper proposes and demonstrates novel types of vision chips that utilize pulse trains for image processing. Two types of chips