15635 search results - page 180 / 3127 » Modelling and Design of VAML |
144
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ASPDAC
2012
ACM
14 years 2 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
167
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DAC
2007
ACM
16 years 7 months ago
2007
ACM
Programming multi-processor systems-on-chip (MPSoC) involves partitioning and mapping of sequential reference code onto multiple parallel processing elements. The immense potentia...
139
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CHI
2008
ACM
16 years 6 months ago
2008
ACM
We describe our approach and initial results in the participatory design of technology relevant to local rural livelihoods. Our approach to design and usability proceeds from rese...
159
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CHI
2003
ACM
16 years 6 months ago
2003
ACM
This paper presents a Computer-Aided Design (CAD) platform for designers to navigate and construct 3D model intuitively through Tangible User Interfaces (TUIs). We suggest that 3D...
140
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ICCAD
2008
IEEE
16 years 3 months ago
2008
IEEE
—To overcome the energy-efficiency limitations imposed by finite sub-threshold slope in CMOS transistors, this paper explores the design of integrated circuits based on nanoelect...