22698 search results - page 3968 / 4540 » Modeling in Software Engineering |
198
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CODES
2007
IEEE
16 years 1 months ago
2007
IEEE
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
195
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CCS
2007
ACM
16 years 1 months ago
2007
ACM
In recent years, web applications have become tremendously popular, and nowadays they are routinely used in security-critical environments, such as medical, financial, and milita...
188
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EMSOFT
2007
Springer
16 years 1 months ago
2007
Springer
Flash memory has many merits such as light weight, shock resistance, and low power consumption, but also has limitations like the erase-before-write property. To overcome such lim...
192
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LCTRTS
2007
Springer
16 years 1 months ago
2007
Springer
The run-time performance of VLIW (very long instruction word) microprocessors depends heavily on the effectiveness of its associated optimizing compiler. Typical VLIW compiler pha...
231
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LCTRTS
2007
Springer
16 years 1 months ago
2007
Springer
Industry’s demand for flexible embedded solutions providing high performance and short time-to-market has led to the development of configurable and extensible processors. The...