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DAC
2008
ACM
15 years 8 months ago
Keeping hot chips cool: are IC thermal problems hot air?
level of accuracy in IC package abstraction (compact models) to ensure robust thermal design. An overarching goal must be to reduce power consumption per function through smart pro...
Ruchir Puri, Devadas Varma, Darvin Edwards, Alan J...
ICCD
2006
IEEE
117views Hardware» more  ICCD 2006»
16 years 3 months ago
System-Level Energy Modeling for Heterogeneous Reconfigurable Chip Multiprocessors
—Field-Programmable Gate Array (FPGA) technology is characterized by continuous improvements that provide new opportunities in system design. Multiprocessors-ona-Programmable-Chi...
Xiaofang Wang, Sotirios G. Ziavras
CBSE
2005
Springer
16 years 8 days ago
A Component-Oriented Model for the Design of Safe Multi-threaded Applications
We previously developed a component-oriented model that combines ideas from self-organizing architectures and from design by contract to address the complexity of design in multi-t...
Reimer Behrends, R. E. Kurt Stirewalt, Laura K. Di...
ICSOC
2009
Springer
16 years 1 months ago
An Automatic Approach to Enable Replacement of Conversational Services
Abstract. In Service Oriented Architectures (SOAs) services invoked in a composition can be replaced by other services, which are possibly discovered and bound at runtime. Most of ...
Luca Cavallaro, Elisabetta Di Nitto, Matteo Pradel...
ASYNC
2007
IEEE
129views Hardware» more  ASYNC 2007»
15 years 10 months ago
Formal Verification of CHP Specifications with CADP Illustration on an Asynchronous Network-on-Chip
Few formal verification techniques are currently available for asynchronous designs. In this paper, we describe a new approach for the formal verification of asynchronous architec...
Gwen Salaün, Wendelin Serwe, Yvain Thonnart, ...