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ISCAS
2008
IEEE
117views Hardware» more  ISCAS 2008»
16 years 1 months ago
Electrical modeling and characterization of 3-D vias
Abstract— Electrical characterization of the resistance, capacitance, and inductance of inter-plane 3-D vias is presented in this paper. Both capacitive and inductive coupling be...
Ioannis Savidis, Eby G. Friedman
IROS
2007
IEEE
144views Robotics» more  IROS 2007»
16 years 1 months ago
Global action selection for illumination invariant color modeling
— A major challenge in the path of widespread use of mobile robots is the ability to function autonomously, learning useful features from the environment and using them to adapt ...
Mohan Sridharan, Peter Stone
HASE
2007
IEEE
16 years 1 months ago
Analytic Model for Web Anomalies Classification
In this paper, an analytic technique is proposed to improve the dynamic web application quality and reliability. The technique integrates orthogonal defect classification (ODC), a...
Nasser Alaeddine, Jeff Tian
ICCAD
1997
IEEE
134views Hardware» more  ICCAD 1997»
15 years 11 months ago
Post-route optimization for improved yield using a rubber-band wiring model
This paper presents a unique approach to improve yield given a routed layout. Currently after routing has been completed and compacted, it generally proceeds to verification witho...
Jeffrey Z. Su, Wayne Wei-Ming Dai
SDL
2001
73views Hardware» more  SDL 2001»
15 years 8 months ago
HyperMSCs with Connectors for Advanced Visual System Modelling and Testing
Experiences with the use of the MSC language for complex system specifications have shown that certain extensions are necessary in order to arrive at sufficiently transparent and m...
Jens Grabowski, Peter Graubmann, Ekkart Rudolph