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DAC
2007
ACM
16 years 7 months ago
Placement of 3D ICs with Thermal and Interlayer Via Considerations
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
Brent Goplen, Sachin S. Sapatnekar
MICCAI
2004
Springer
16 years 7 months ago
Progressive Attenuation Fields: Fast 2D-3D Image Registration Without Precomputation
This paper introduces the progressive attenuation field (PAF), a method to speed up computation of digitally reconstructed radiograph (DRR) images during intensity-based 2D-3D regi...
Torsten Rohlfing, Daniel B. Russakoff, Joachim Den...
CHI
2008
ACM
16 years 7 months ago
Evaluating motion constraints for 3D wayfinding in immersive and desktop virtual environments
Motion constraints providing guidance for 3D navigation have recently been suggested as a way of offloading some of the cognitive effort of traversing complex 3D environments on a...
Niklas Elmqvist, Mihail Eduard Tudoreanu, Philippa...
RECOMB
2008
Springer
16 years 7 months ago
Automatic Recognition of Cells (ARC) for 3D Images of C. elegans
The development of high-resolution microscopy makes possible the high-throughput screening of cellular information, such as gene expression at single cell resolution. One of the cr...
Fuhui Long, Hanchuan Peng, Xiao Liu, Stuart K. Kim...
ICRA
2009
IEEE
259views Robotics» more  ICRA 2009»
16 years 1 months ago
Fast Point Feature Histograms (FPFH) for 3D registration
— In our recent work [1], [2], we proposed Point Feature Histograms (PFH) as robust multi-dimensional features which describe the local geometry around a point p for 3D point clo...
Radu Bogdan Rusu, Nico Blodow, Michael Beetz