7326 search results - page 386 / 1466 » Methods for modalities 3 |
169
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ICCAD
2010
IEEE
15 years 4 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...
216
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AVSS
2009
IEEE
15 years 4 months ago
2009
IEEE
A novel algorithm for 3D face recognition based point cloud rotations, multiple projections, and voted keypoint matching is proposed and evaluated. The basic idea is to rotate eac...
152
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3DOR
2010
15 years 1 months ago
2010
With the increasing amount of 3D data and the ability of capture devices to produce low-cost multimedia data, the capability to select relevant information has become an interesti...
295
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ICASSP
2011
IEEE
14 years 10 months ago
2011
IEEE
Image geo-registration is the process of relating a photograph and its pose to referenced world coordinates. The application is relevant, especially to the social networking, phot...
175
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ASPDAC
2011
ACM
14 years 10 months ago
2011
ACM
Abstract— Three-dimensional (3D) integration and Networkon-Chip (NoC) are both proposed to tackle the on-chip interconnect scaling problems, and extensive research efforts have b...