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ICCV
2007
IEEE
16 years 8 months ago
A systematic approach for 2D-image to 3D-range registration in urban environments
The photorealistic modeling of large-scale objects, such as urban scenes, requires the combination of range sensing technology and digital photography. In this paper, we attack th...
Lingyun Liu, Ioannis Stamos
DAC
2011
ACM
14 years 6 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
ISPD
2005
ACM
151views Hardware» more  ISPD 2005»
16 years 4 days ago
Thermal via placement in 3D ICs
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...
Brent Goplen, Sachin S. Sapatnekar
KDD
2000
ACM
222views Data Mining» more  KDD 2000»
15 years 10 months ago
Interactive exploration of very large relational datasets through 3D dynamic projections
The grand tour, one of the most popular methods for multidimensional data exploration, is based on orthogonally projecting multidimensional data to a sequence of lower dimensional...
Li Yang
CVPR
2007
IEEE
16 years 8 months ago
Model-Guided Segmentation of 3D Neuroradiological Image Using Statistical Surface Wavelet Model
This paper proposes a novel model-guided segmentation framework utilizing a statistical surface wavelet model as a shape prior. In the model building process, a set of training sh...
Yang Li, Tiow Seng Tan, Ihar Volkau, Wieslaw L. No...