7326 search results - page 274 / 1466 » Methods for modalities 3 |
150
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ICCD
2007
IEEE
16 years 3 months ago
2007
IEEE
One of the biggest challenges in 3D stacked IC design is heat dissipation. Incorporating thermal vias is a promising method for reducing the temperatures of 3D ICs. The bonding st...
131
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ICRA
2009
IEEE
16 years 1 months ago
2009
IEEE
— We propose a new approach to appearance based loop detection from metric 3D maps, exploiting the NDT surface representation. Locations are described with feature histograms bas...
179
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ICRA
2007
IEEE
16 years 26 days ago
2007
IEEE
— Increasing the field of view of camera is an important issue practical in robot vision. One solution is to consider catadioptric camera that allows a 360o field of view. In t...
200
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ICCS
2007
Springer
16 years 21 days ago
2007
Springer
Abstract. In this paper, we introduce a new piecewise linear parameterization of 3D surface patches which provides a basis for texture mapping, morphing, remeshing, and geometry im...
153
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CVPR
2006
IEEE
16 years 19 days ago
2006
IEEE
In this paper we describe a method that estimates the motion of a calibrated camera (settled on an experimental vehicle) and the tridimensional geometry of the environment. The on...