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DAC
2012
ACM
13 years 9 months ago
Exploiting die-to-die thermal coupling in 3D IC placement
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim
3DIM
2007
IEEE
16 years 27 days ago
3D Challenges and a Non-In-Depth Overview of Recent Progress
Although a lot of effort already went into the development of 3D acquisition technology, and existing methods come of age, several challenges remain. We try to give a – probably...
Luc J. Van Gool, Bastian Leibe, Pascal Müller...
CHI
1997
ACM
15 years 10 months ago
Overlaying Motion, Time and Distance in 3-Space
An innovative method for visually and functionally combining the elements of motion, time and distance in a three-dimensional computer animation is presented. At a glance, the ela...
Mike Pell
CORR
2008
Springer
135views Education» more  CORR 2008»
15 years 6 months ago
The Isomorphism Problem for Planar 3-Connected Graphs is in Unambiguous Logspace
The isomorphism problem for planar graphs is known to be efficiently solvable. For planar 3-connected graphs, the isomorphism problem can be solved by efficient parallel algorithm...
Thomas Thierauf, Fabian Wagner
CVPR
2006
IEEE
16 years 8 months ago
Vessel Crawlers: 3D Physically-based Deformable Organisms for Vasculature Segmentation and Analysis
We present a novel approach to the segmentation and analysis of vasculature from volumetric medical image data. Our method is an adoption and significant extension of deformable o...
Chris McIntosh, Ghassan Hamarneh