In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
Although a lot of effort already went into the development of 3D acquisition technology, and existing methods come of age, several challenges remain. We try to give a – probably...
An innovative method for visually and functionally combining the elements of motion, time and distance in a three-dimensional computer animation is presented. At a glance, the ela...
The isomorphism problem for planar graphs is known to be efficiently solvable. For planar 3-connected graphs, the isomorphism problem can be solved by efficient parallel algorithm...
We present a novel approach to the segmentation and analysis of vasculature from volumetric medical image data. Our method is an adoption and significant extension of deformable o...