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DAC
2010
ACM
15 years 10 months ago
Cost-driven 3D integration with interconnect layers
The ever increasing die area of Chip Multiprocessors (CMPs) affects manufacturing yield, resulting in higher manufacture cost. Meanwhile, network-on-chip (NoC) has emerged as a p...
Xiaoxia Wu, Guangyu Sun, Xiangyu Dong, Reetuparna ...
CAMAD
2006
IEEE
15 years 10 months ago
A packet-level characterization of network traffic
In this paper we show results from a packet-level traffic characterization aiming at finding spatial and temporal invariances of TCP based applications, such as HTTP and SMTP. We d...
Alberto Dainotti, Antonio Pescapè, Giorgio ...
CODES
2009
IEEE
15 years 10 months ago
An MDP-based application oriented optimal policy for wireless sensor networks
Technological advancements due to Moore’s law have led to the proliferation of complex wireless sensor network (WSN) domains. One commonality across all WSN domains is the need ...
Arslan Munir, Ann Gordon-Ross
FAST
2010
15 years 9 months ago
Discovery of Application Workloads from Network File Traces
An understanding of application I/O access patterns is useful in several situations. First, gaining insight into what applications are doing with their data at a semantic level he...
Neeraja J. Yadwadkar, Chiranjib Bhattacharyya, K. ...
ISPE
2003
15 years 8 months ago
Task-oriented engineering of coordinated software systems
ABSTRACT: In the context of Internet-based applications where heterogeneous, legacy entities should integrate and cooperate, the efficiency of the software production process is a ...
Enrico Denti, Andrea Omicini, Alessandro Ricci