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TPDS
1998
129views more  TPDS 1998»
15 years 6 months ago
The Offset Cube: A Three-Dimensional Multicomputer Network Topology Using Through-Wafer Optics
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
W. Stephen Lacy, José Cruz-Rivera, D. Scott...
ISQED
2010
IEEE
176views Hardware» more  ISQED 2010»
15 years 5 months ago
A 2-port 6T SRAM bitcell design with multi-port capabilities at reduced area overhead
Low power, minimum transistor count and fast access static random access memory (SRAM) is essential for embedded multimedia and communication applications realized using system on...
Jawar Singh, Dilip S. Aswar, Saraju P. Mohanty, Dh...
SEUS
2010
IEEE
15 years 4 months ago
Crash Recovery in FAST FTL
NAND flash memory is one of the non-volatile memories and has been replacing hard disk in various storage markets from mobile devices, PC/Laptop computers, even to enterprise serv...
Sungup Moon, Sang-Phil Lim, Dong-Joo Park, Sang-Wo...
SAMOS
2010
Springer
15 years 4 months ago
OpenCL-based design methodology for application-specific processors
OpenCL is a programming language standard which enables the programmer to express the application by structuring its computation as kernels. The OpenCL compiler is given the explic...
Pekka O. Jaskelainen, Carlos S. de La Lama, Pablo ...
RTAS
2011
IEEE
14 years 10 months ago
ARCH: Practical Channel Hopping for Reliable Home-Area Sensor Networks
Abstract—Home area networks (HANs) promise to enable sophisticated home automation applications such as smart energy usage and assisted living. However, recent empirical study of...
Mo Sha, Gregory Hackmann, Chenyang Lu
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