4396 search results - page 554 / 880 » Measuring the Architecture Design Process |
173
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CODES
2008
IEEE
16 years 1 months ago
2008
IEEE
Modern embedded compute platforms increasingly contain both microprocessors and field-programmable gate arrays (FPGAs). The FPGAs may implement accelerators or other circuits to s...
170
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DAC
2009
ACM
16 years 7 months ago
2009
ACM
Abstract--To reduce chip-scale topography variation in Chemical Mechanical Polishing (CMP) process, dummy fill is widely used to improve the layout density uniformity. Previous res...
171
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DAC
2004
ACM
16 years 7 months ago
2004
ACM
Electrothermal couplings between supply voltage, operating frequency, power dissipation and die temperature have been shown to significantly impact the energy-delay-product (EDP) ...
202
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DAC
2005
ACM
16 years 7 months ago
2005
ACM
: Due to exponential increase in subthreshold leakage with technology scaling and temperature increase, leakage power is becoming a major fraction of total power in the active mode...
167
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DAC
2006
ACM
16 years 7 months ago
2006
ACM
Modern integrated circuits require careful attention to the soft-error rate (SER) resulting from bit upsets, which are normally caused by alpha particle or neutron hits. These eve...