164 search results - page 14 / 33 » Measuring performance, power, and temperature from real proc... |
156
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NOCS
2010
IEEE
15 years 4 months ago
2010
IEEE
—Three-dimensional network-on-chip (3D NoC), the combination of NoC and die-stacking 3D IC technology, is motivated to achieve lower latency, lower power consumption, and higher ...
142
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ASPDAC
2008
ACM
15 years 8 months ago
2008
ACM
In this paper, we investigate a new architecture-level thermal characterization problem from behavioral modeling perspective to address the emerging thermal related analysis and o...
147
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ISLPED
2005
ACM
15 years 11 months ago
2005
ACM
This paper studies the impact on energy efficiency and thermal behavior of design style and clock-gating style in queue and array structures. These structures are major sources of...
144
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SIES
2008
IEEE
16 years 13 days ago
2008
IEEE
—Chip multiprocessing design is an emerging trend for embedded systems. In this paper, we introduce a Java multiprocessor system-on-chip called JopCMP. It is a symmetric shared-m...
149
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SIGCOMM
2009
ACM
16 years 17 days ago
2009
ACM
Besides a more widespread sensitivity to ecological issues, the interest in energy-efficient network technologies springs from heavy and critical economical needs, since both ener...