2749 search results - page 207 / 550 » Manufacturing-Aware Physical Design |
174
click to vote
IPPS
2003
IEEE
15 years 11 months ago
2003
IEEE
Tiled architectures can provide a model for early estimation of global interconnect costs. A design exploration tool for reconfigurable architectures is currently under developmen...
178
click to vote
ICIP
2007
IEEE
16 years 8 months ago
2007
IEEE
In digital imaging applications, data are typically obtained via a spatial subsampling procedure implemented as a color filter array--a physical construction whereby only a single...
171
click to vote
ICCD
2007
IEEE
16 years 3 months ago
2007
IEEE
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
139
click to vote
TEI
2009
ACM
16 years 1 months ago
2009
ACM
Today a growing community of DIY-practitioners, artists and designers are using microcontroller-based toolkits to express their concepts for digital artifacts by building them. Ho...
173
click to vote
GLVLSI
2009
IEEE
16 years 1 months ago
2009
IEEE
Recently, cooperative communication has attracted a lot of attention for its potential to increase spatial diversity. However, limited attention has been paid to the physical laye...