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210
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Publication
Software engineering is by nature a highly collaborative
activity and being able to collaborate effectively is a
key factor for project success. However, collaborating effectivel...
214
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SLIP
2009
ACM
16 years 1 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
172
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SASO
2008
IEEE
16 years 1 months ago
2008
IEEE
Many real–world networks show a scale–free degree distribution, a structure that is known to be very stable in case of random failures. Unfortunately, the very same structure ...
163
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ICEIS
2007
IEEE
16 years 1 months ago
2007
IEEE
Although extensive literature on BPR is available, there is still a lack of concrete guidance on actually changing processes for the better. In this paper we propose and detail out...
176
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SIGECOM
2005
ACM
16 years 9 days ago
2005
ACM
When distributing digital content over a broadcast channel it’s often necessary to revoke users whose access privileges have expired, thus preventing them from recovering the co...