1307 search results - page 173 / 262 » Low Power Hardware for a High Performance PDA |
163
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MICRO
2006
IEEE
16 years 12 days ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
193
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IPCCC
2006
IEEE
16 years 12 days ago
2006
IEEE
Low power has been considered as an important issue in instruction cache (I-cache) designs. Several studies have shown that the I-cache can be tuned to reduce power. These techniq...
186
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HPCA
2009
IEEE
16 years 7 months ago
2009
IEEE
Magnetic Random Access Memory (MRAM) is considered to be a promising future memory technology due to its low leakage power, high density and fast read speed. The heterogeneous int...
157
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SIGCOMM
2010
ACM
15 years 6 months ago
2010
ACM
SSL/TLS is a standard protocol for secure Internet communication. Despite its great success, today's SSL deployment is largely limited to security-critical domains. The low a...
146
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ISCAS
2006
IEEE
16 years 12 days ago
2006
IEEE
—As turbo decoding is a highly memory-intensive algorithm consuming large power, a major issue to be solved in practical implementation is to reduce power consumption. This paper...