Graphics cards exercise increasingly more computing power and are highly optimized for high data transfer volumes. In contrast typical workstations perform badly when data exceeds...
—The sustained push for performance, transistor count, and instruction level parallelism has reached a point where chip level power density issues are at the forefront of design ...
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
IP routers are now increasingly expected to do more than just traditional packet forwarding – they must be extensible as well as scalable. It is a challenge to design a router a...
Nanoelectronic devices are expected to have extremely high and variable fault rates; thus future processor architectures based on these unreliable devices need to be built with fa...