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» Issues in the Integration of IN and TMN
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ICC
2008
IEEE
183views Communications» more  ICC 2008»
16 years 1 months ago
An Autonomic Service Delivery Platform for Service-Oriented Network Environments
CALLAWAY, ROBERT DAVID. An Autonomic Service Delivery Platform for Service-Oriented Network Environments. (Under the direction of Michael Devetsikiotis and Yannis Viniotis.) Servi...
Robert D. Callaway, Michael Devetsikiotis, Yannis ...
GLVLSI
2006
IEEE
119views VLSI» more  GLVLSI 2006»
16 years 23 days ago
Thermal analysis of a 3D die-stacked high-performance microprocessor
3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
Kiran Puttaswamy, Gabriel H. Loh
ICSOC
2004
Springer
16 years 2 days ago
A service-oriented architecture for digital libraries
CiteSeer is currently a very large source of meta-data information on the World Wide Web (WWW). This meta-data is the key material for the Semantic Web. Still, CiteSeer is not yet...
Yves Petinot, C. Lee Giles, Vivek Bhatnagar, Prade...
ICRA
2002
IEEE
101views Robotics» more  ICRA 2002»
15 years 11 months ago
Rover Autonomy for Long Range Navigation and Science Data Acquisition on Planetary Surfaces
This paper describes recent work undertaken at the Jet Propulsion Laboratory in Pasadena, CA in the area of increased rover autonomy for planetary surface operations. The primary ...
Terrance L. Huntsberger, Hrand Aghazarian, Yang Ch...
209
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NANONET
2009
Springer
199views Chemistry» more  NANONET 2009»
15 years 11 months ago
Through Silicon Via-Based Grid for Thermal Control in 3D Chips
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
José L. Ayala, Arvind Sridhar, Vinod Pangra...