10600 search results - page 1812 / 2120 » Issues in process architecture |
161
click to vote
SIGCOMM
2009
ACM
16 years 1 months ago
2009
ACM
New protocols for the data link and network layer are being proposed to address limitations of current protocols in terms of scalability, security, and manageability. High-speed r...
201
Voted
MICRO
2008
IEEE
16 years 1 months ago
2008
IEEE
With the recent design shift towards increasing the number of processing elements in a chip, high-bandwidth support in on-chip interconnect is essential for low-latency communicat...
203
Voted
SEUS
2008
IEEE
16 years 1 months ago
2008
IEEE
Abstract— This paper presents SW synthesis using Embedded System Environment (ESE), a tool set for design of multicore embedded systems. We propose a classification of multicore...
212
click to vote
3DIM
2007
IEEE
16 years 1 months ago
2007
IEEE
The ICP (Iterative Closest Point) algorithm is the de facto standard for geometric alignment of threedimensional models when an initial relative pose estimate is available. The ba...
220
click to vote
VLSID
2006
IEEE
16 years 23 days ago
2006
IEEE
As the IC process technology scales, the oxide thickness and operating voltage continues to decrease. The gate oxide thickness in recent and future IC process technology has appro...