Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
It would be useful if software engineers/instructors could be aware that remote team members/students are having difficulty with their programming tasks. We have developed an appr...
Clusters provide powerful computing environments, but in practice much of this power goes to waste, due to the static allocation of tasks to nodes, regardless of their changing co...
— Efficient and scalable live-streaming overlay construction has become a hot topic recently. In order to improve the performance metrics, such as startup delay, source-to-end de...
Xiaofei Liao, Hai Jin, Yunhao Liu, Lionel M. Ni, D...
Computing and maintaining network structures for efficient data aggregation incurs high overhead for dynamic events where the set of nodes sensing an event changes with time. Mor...