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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 4 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
CSCW
2010
ACM
16 years 4 months ago
Are you having difficulty?
It would be useful if software engineers/instructors could be aware that remote team members/students are having difficulty with their programming tasks. We have developed an appr...
Jason Carter, Prasun Dewan
VEE
2009
ACM
172views Virtualization» more  VEE 2009»
16 years 2 months ago
Entropy: a consolidation manager for clusters
Clusters provide powerful computing environments, but in practice much of this power goes to waste, due to the static allocation of tasks to nodes, regardless of their changing co...
Fabien Hermenier, Xavier Lorca, Jean-Marc Menaud, ...
INFOCOM
2006
IEEE
16 years 1 months ago
AnySee: Peer-to-Peer Live Streaming
— Efficient and scalable live-streaming overlay construction has become a hot topic recently. In order to improve the performance metrics, such as startup delay, source-to-end de...
Xiaofei Liao, Hai Jin, Yunhao Liu, Lionel M. Ni, D...
SENSYS
2006
ACM
16 years 1 months ago
Scalable data aggregation for dynamic events in sensor networks
Computing and maintaining network structures for efficient data aggregation incurs high overhead for dynamic events where the set of nodes sensing an event changes with time. Mor...
Kai-Wei Fan, Sha Liu, Prasun Sinha
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