7956 search results - page 1291 / 1592 » Into the Future |
151
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ASPDAC
2012
ACM
14 years 2 months ago
2012
ACM
—The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technolog...
182
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ASPDAC
2012
ACM
14 years 2 months ago
2012
ACM
In this paper, we examine the integration potential and explore the design space of low power thermal reliable on-chip interconnect synthesis featuring nanophotonics Wavelength Di...
189
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CSCW
2012
ACM
14 years 2 months ago
2012
ACM
In this article we describe a novel approach to collaborative video authoring using handheld projectors. PicoTales are created by sketching story elements on a projector+phone pro...
171
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HICSS
2012
IEEE
14 years 2 months ago
2012
IEEE
The success of open government initiatives depends on understanding the informational needs of the concerned citizens and other stakeholders as prerequisite for open access to rel...
171
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HICSS
2012
IEEE
14 years 2 months ago
2012
IEEE
The advent of the smartphone as a highly complex technology has been accompanied by mobile operating systems (OS), large communities of developers, diverse content providers, and ...