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DAC
2011
ACM
14 years 6 months ago
Thermal-aware cell and through-silicon-via co-placement for 3D ICs
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Jason Cong, Guojie Luo, Yiyu Shi
DATE
2009
IEEE
116views Hardware» more  DATE 2009»
16 years 1 months ago
An MDE methodology for the development of high-integrity real-time systems
—This paper reports on experience gained and lessons learned from an intensive investigation of model-driven engineering methodology and technology for application to high-integr...
Silvia Mazzini, Stefano Puri, Tullio Vardanega
ACSAC
2006
IEEE
16 years 22 days ago
Back to the Future: A Framework for Automatic Malware Removal and System Repair
Malware is software with malicious intent. Besides viruses and worms, spyware, adware, and other newer forms of malware have recently emerged as widely-spread threats to system se...
Francis Hsu, Hao Chen, Thomas Ristenpart, Jason Li...
ICWE
2004
Springer
16 years 1 days ago
Authoring and Dynamic Generation of Adaptive E-courses
Abstract. Adaptive hypermedia constitutes a pretty rich resource for developing web-based courses. With the aim of dynamically generating adaptive ecourses, we have developed the T...
Rosa M. Carro, Manuel Freire, Estefanía Mar...
BMCBI
2008
91views more  BMCBI 2008»
15 years 6 months ago
Presenting and exploring biological pathways with PathVisio
nd: Biological pathways are a useful abstraction of biological concepts, and software tools to deal with pathway diagrams can help biological research. PathVisio is a new visualiz...
Martijn P. van Iersel, Thomas Kelder, Alexander R....