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DAC
2012
ACM
13 years 9 months ago
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
Moongon Jung, David Z. Pan, Sung Kyu Lim
DAC
2009
ACM
16 years 8 months ago
Contract-based system-level composition of analog circuits
Efficient system-level design is increasingly relying on hierarchical design-space exploration, as well as compositional methods, to shorten time-to-market, leverage design re-use...
Xuening Sun, Pierluigi Nuzzo, Chang-Ching Wu, Albe...
MICCAI
2003
Springer
16 years 7 months ago
Analysis Tool for Diffusion Tensor MRI
Abstract. Diffusion Tensor Imaging (DTI) is becoming a routine magnetic resonance technique to study white matter properties and alterations of fiber integrity due to pathology. Th...
Pierre Fillard, Guido Gerig
SIGSOFT
2001
ACM
16 years 7 months ago
WREN---an environment for component-based development
Prior research in software environments focused on three important problems-- tool integration, artifact management, and process guidance. The context for that research, and hence...
Chris Lüer, David S. Rosenblum
HPCA
2006
IEEE
16 years 7 months ago
Exploiting parallelism and structure to accelerate the simulation of chip multi-processors
Simulation is an important means of evaluating new microarchitectures. Current trends toward chip multiprocessors (CMPs) try the ability of designers to develop efficient simulato...
David A. Penry, Daniel Fay, David Hodgdon, Ryan We...