In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
Efficient system-level design is increasingly relying on hierarchical design-space exploration, as well as compositional methods, to shorten time-to-market, leverage design re-use...
Abstract. Diffusion Tensor Imaging (DTI) is becoming a routine magnetic resonance technique to study white matter properties and alterations of fiber integrity due to pathology. Th...
Prior research in software environments focused on three important problems-- tool integration, artifact management, and process guidance. The context for that research, and hence...
Simulation is an important means of evaluating new microarchitectures. Current trends toward chip multiprocessors (CMPs) try the ability of designers to develop efficient simulato...
David A. Penry, Daniel Fay, David Hodgdon, Ryan We...