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DAC
2009
ACM
16 years 7 months ago
Flip-chip routing with unified area-I/O pad assignments for package-board co-design
In this paper, we present a novel flip-chip routing algorithm for package-board co-design. Unlike the previous works that can consider only either free- or pre-assignment routing,...
Jia-Wei Fang, Martin D. F. Wong, Yao-Wen Chang
DAC
2009
ACM
16 years 7 months ago
A direct integral-equation solver of linear complexity for large-scale 3D capacitance and impedance extraction
State-of-the-art integral-equation-based solvers rely on techniques that can perform a matrix-vector multiplication in O(N) complexity. In this work, a fast inverse of linear comp...
Wenwen Chai, Dan Jiao, Cheng-Kok Koh
DAC
2008
ACM
16 years 7 months ago
Latency and bandwidth efficient communication through system customization for embedded multiprocessors
We present a cross-layer customization methodology for latency and bandwidth efficient inter-core communication in embedded multiprocessors. The methodology integrates compiler, o...
Chenjie Yu, Peter Petrov
DAC
2008
ACM
16 years 7 months ago
Automatic package and board decoupling capacitor placement using genetic algorithms and M-FDM
In the design of complex power distribution networks (PDN) with multiple power islands, it is required that the PDN represents a low impedance as seen by the digital modules. This...
Krishna Bharath, Ege Engin, Madhavan Swaminathan
DAC
2008
ACM
16 years 7 months ago
Path smoothing via discrete optimization
A fundamental problem in timing-driven physical synthesis is the reduction of critical paths in a design. In this work, we propose a powerful new technique that moves (and can als...
Michael D. Moffitt, David A. Papa, Zhuo Li, Charle...
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