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ICCAD
2007
IEEE
124views Hardware» more  ICCAD 2007»
16 years 3 months ago
3D-STAF: scalable temperature and leakage aware floorplanning for three-dimensional integrated circuits
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
DAC
2010
ACM
15 years 10 months ago
PreDVS: preemptive dynamic voltage scaling for real-time systems using approximation scheme
System optimization techniques based on dynamic voltage scaling (DVS) are widely used with the aim of reducing processor energy consumption. Inter-task DVS assigns the same voltag...
Weixun Wang, Prabhat Mishra
CCS
2010
ACM
15 years 4 months ago
The limits of automatic OS fingerprint generation
Remote operating system fingerprinting relies on implementation differences between OSs to identify the specific variant executing on a remote host. Because these differences can ...
David W. Richardson, Steven D. Gribble, Tadayoshi ...
PAMI
2012
13 years 8 months ago
A Least-Squares Framework for Component Analysis
— Over the last century, Component Analysis (CA) methods such as Principal Component Analysis (PCA), Linear Discriminant Analysis (LDA), Canonical Correlation Analysis (CCA), Lap...
Fernando De la Torre
WWW
2005
ACM
16 years 7 months ago
A service creation environment based on end to end composition of Web services
The demand for quickly delivering new applications is increasingly becoming a business imperative today. Application development is often done in an ad hoc manner, without standar...
Vikas Agarwal, Koustuv Dasgupta, Neeran M. Karnik,...