Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
System optimization techniques based on dynamic voltage scaling (DVS) are widely used with the aim of reducing processor energy consumption. Inter-task DVS assigns the same voltag...
Remote operating system fingerprinting relies on implementation differences between OSs to identify the specific variant executing on a remote host. Because these differences can ...
David W. Richardson, Steven D. Gribble, Tadayoshi ...
— Over the last century, Component Analysis (CA) methods such as Principal Component Analysis (PCA), Linear Discriminant Analysis (LDA), Canonical Correlation Analysis (CCA), Lap...
The demand for quickly delivering new applications is increasingly becoming a business imperative today. Application development is often done in an ad hoc manner, without standar...
Vikas Agarwal, Koustuv Dasgupta, Neeran M. Karnik,...