1724 search results - page 97 / 345 » Industrial applications |
164
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DAC
2010
ACM
15 years 10 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
155
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HIPEAC
2009
Springer
16 years 1 months ago
2009
Springer
Process variations, which lead to timing and power variations across identically-designed components, have been identified as one of the key future design challenges by the semico...
180
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ICSE
2000
IEEE-ACM
15 years 10 months ago
2000
IEEE-ACM
We present Galileo, an innovative engineering modeling and analysis tool built using an approach we call packageoriented programming (POP). Galileo represents an ongoing evaluatio...
180
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BMCBI
2007
15 years 6 months ago
2007
Background: The progress in the "-omic" sciences has allowed a deeper knowledge on many biological systems with industrial interest. This knowledge is still rarely used ...
133
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ECEASST
2006
15 years 6 months ago
2006
Motivated by the promotion of rewriting techniques and their use in major industrial applications, we have designed Tom: a pattern matching layer on top of conventional programming...